LR200 Series | Extended Neck Wafer Butterfly Valve
C&C Industries
The C&C LR200 Series Extended Neck Wafer Butterfly Valve is designed for insulated piping systems and elevated temperature applications where standard wafer valves become inaccessible or vulnerable to heat transfer.
Its extended neck design allows the actuator and mounting interface to remain above insulation, eliminating the need to remove insulation for operation or maintenance. The smooth body construction and pinless disc design improve durability while reducing potential leak paths and wear points.
Built for reliability in demanding environments, the LR200 Series provides the accessibility and performance required for process, refining, and high-temperature service.
Typical Applications:
Insulated pipelines, refining systems, chemical processing, oil & gas facilities, and elevated temperature service
Key Features
- Extended neck design for insulated systems
- Wafer-style compact body
- Pinless disc design
- Smooth body construction
- Sizes from 2” through 12”
- Ductile iron ASTM A536 body
- Multiple disc material options
- 416 stainless steel stem
- Seat options: Buna-N, EPDM
- 150 to 200 PSI pressure rating
- ANSI 125/150 compatible
- ISO mounting compatibility
PERFORMANCE ADVANTAGES
Why the LR200 Series Wafer BFV Performs Where It Counts
MAINTAINS ACCESSIBILITY IN INSULATED
PIPE SYSTEMS
The extended neck allows operators to access the valve and actuator without removing insulation, reducing downtime and simplifying maintenance.
REDUCES HEAT TRANSFER TO ACTUATORS
By increasing the distance between process media and actuation components, the valve helps protect actuators from heat-related damage and performance degradation.
IMPROVES LONG-TERM RELIABILITY WITH PINLESS DISC DESIGN
The pinless disc eliminates potential failure points associated with traditional pinned designs, improving durability under repeated cycling.
OPTIMIZED FOR PROCESS & REFINING ENVIRONMENTS
The combination of extended neck geometry and robust materials makes the LR200 ideal for systems where temperature, accessibility, and reliability are critical.